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| 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com ph: 972-371-3726 fax: 972-371-6016 mbl: 214-435-6610 Conclusion: The following qualification successfully meets the quality and reliability standards required of all Dallas Semiconductor packages: 32 TSOP 8mm In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing assemblies will continue to meet Maxim's quality and reliability standards. The current status of the reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html. Package Description: A description of this assembly can be found in the product data sheet. You can find the product data sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm. Reliability Derating: The Arrhenius model will be used to determine the acceleration factor for failure mechanisms that are temperature accelerated. AfT = exp((Ea/k)*(1/Tu - 1/Ts)) = tu/ts AfT = Acceleration factor due to Temperature tu = Time at use temperature (e.g. 55C) ts = Time at stress temperature (e.g. 125C) k = Boltzmann's Constant (8.617 x 10-5 eV/K) Tu = Temperature at Use (K) Ts = Temperature at Stress (K) Ea = Activation Energy (e.g. 0.7 ev) The activation energy of the failure mechanism is derived from either internal studies or industry accepted standards, or activation energy of 0.7ev will be used whenever actual failure mechanisms or their activation energies are unknown. All deratings will be done from the stress ambient temperature to the use ambient temperature. An exponential model will be used to determine the acceleration factor for failure mechanisms, which are voltage accelerated. AfV = exp(B*(Vs - Vu)) AfV = Acceleration factor due to Voltage Vs = Stress Voltage (e.g. 7.0 volts) Vu = Maximum Operating Voltage (e.g. 5.5 volts) B = Constant related to failure mechanism type (e.g. 1.0, 2.4, 2.7, etc.) The Constant, B, related to the failure mechanism is derived from either internal studies or industry accepted standards, or a B of 1.0 will be used whenever actual failure mechanisms or their B are unknown. All deratings will be done from the stress voltage to the maximum operating voltage. Failure rate data from the operating life test is reported using a Chi-Squared statistical model at the 60% or 90% confidence level (Cf). The failure rate, Fr, is related to the acceleration during life test by: Fr = X/(ts * AfV * AfT * N * 2) X = Chi-Sq statistical upper limit N = Life test sample size Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate is related to MTTF by: MTTF = 1/Fr NOTE: MTTF is frequently used interchangeably with MTBF. The calculated failure rate for this device/process is: FAILURE RATE: MTTF (YRS): 37651 FITS: 3.0 The parameters used to calculate this failure rate are as follows: Cf: 60% Ea: 0.7 B: 0 Tu: 25 C Vu: 5.5 Volts The reliability data follows. Some of the data in this report may be generic. A the start of this data is a description of the assembly vehicle used to generate this reliability data. The next section is the detailed reliability data for each stress. If there are additional assemblies used as part of this report, a description of each will follow which includes the respective reliability data for that assembly. Where appropriate, preconditioning is performed before all stresses and the bond crater test unless otherwise noted. The reliability data section includes the latest data available. Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: PACKAGE TESTS DESCRIPTION SOLDERABILITY DATE CODE CONDITION 0429 JESD22-B102 Total: READPOINT QTY FAILS 15 0 0 FA# ASE 28 TSOP 8x13.4x0.965 Sumitomo G700 Stamped Alloy 42 Sn Plate 100% Matte Sumitomo 1076 DS Au / 1.0 mil UL 94-V0 Level 3 0429 to 0429 Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: OPERATING LIFE DESCRIPTION HIGH VOLTAGE LIFE HIGH VOLTAGE LIFE HIGH VOLTAGE LIFE ATK (Amkor, K) 28 TSOP 8x13.4x0.965 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0223 to 0303 DATE CODE CONDITION 0223 0223 0303 125C, 7.0 VOLTS 125C, 7.0 VOLTS 125C, 6.0 VOLTS READPOINT 1000 HRS 1000 HRS 1000 HRS Total: QTY FAILS 80 160 77 0 0 0 0 FA# Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: ATK (Amkor, K) 32 TSOP 8x20x1.0 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0038 to 0303 MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION ULTRASOUND STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW EXTERNAL VISUAL PRECONDITION U/S DATE CODE CONDITION 0038 J-STD-020 125C 30C/60% R.H. 235C +5/-0C MIL-STD-883-2009 J-STD-020 Total: 24 240 3 HRS HRS PASS READPOINT QTY FAILS 8 8 8 8 8 8 0 0 0 0 0 FA# OPERATING LIFE DESCRIPTION DATE CODE CONDITION READPOINT QTY FAILS FA# HIGH VOLTAGE LIFE HIGH VOLTAGE LIFE 0038 0303 125C, 6.0 VOLTS 125C, 6.0 VOLTS 1000 HRS 1000 HRS Total: 116 77 0 0 0 PACKAGE TESTS DESCRIPTION SOLDERABILITY X-RAY PHYSICAL DIMENSIONS MARK PERMANENCY LEAD INTEGRITY DATE CODE CONDITION 0038 0038 MIL-STD-883-2003 MIL-STD-883-2012 : TOP & SIDE VIEW MIL-STD-883-2016 MIL-STD-883-2015 MIL-STD-883-2004 : COND B2 Total: READPOINT QTY FAILS 3 6 6 6 6 0 0 0 0 0 0 FA# PRECONDITIONING LEVEL 3 DESCRIPTION STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW DATE CODE CONDITION 0038 125C 30C/60% R.H. 235C +5/-0C READPOINT 24 240 3 HRS HRS PASS Total: QTY FAILS 315 315 315 0 0 FA# TEMPERATURE CYCLE DESCRIPTION TEMP CYCLE DATE CODE CONDITION 0038 -55C TO 125C READPOINT 1000 CYS Total: QTY FAILS 77 0 0 FA# TEMPERATURE HUMIDITY BIAS DESCRIPTION HAST DATE CODE CONDITION 0038 130C, 85%R.H.,5.5V READPOINT 100 HRS Total: QTY FAILS 77 0 0 FA# UNBIASED MOISTURE RESISTANCE DESCRIPTION HAST, NO BIAS DATE CODE CONDITION 0038 130C, 85% R.H. READPOINT 200 HRS Total: QTY FAILS 45 0 0 FA# Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: ATP (Amkor, PI) 28 TSOP 8x13.4x0.965 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 9921 to 9924 MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION PRECONDITION U/S EXTERNAL VISUAL ULTRASOUND STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW PRECONDITION U/S ULTRASOUND STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW EXTERNAL VISUAL 9921 DATE CODE CONDITION 9921 J-STD-020 MIL-STD-883-2009 J-STD-020 125C 30C/60% R.H. 235C +5/-0C J-STD-020 J-STD-020 125C 30C/60% R.H. 235C +5/-0C MIL-STD-883-2009 Total: 24 240 3 HRS HRS PASS 24 240 3 HRS HRS PASS READPOINT QTY FAILS 6 8 8 8 8 8 8 8 8 8 8 8 0 0 0 0 0 0 0 0 0 FA# OPERATING LIFE DESCRIPTION HIGH VOLTAGE LIFE HIGH VOLTAGE LIFE DATE CODE CONDITION 9921 9924 125C, 7.0 VOLTS 125C, 7.0 VOLTS READPOINT 1000 HRS 1000 HRS Total: QTY FAILS 116 116 0 1 1 990165 FA# PACKAGE TESTS DESCRIPTION CONSTRUCTION ANALYSIS SOLDERABILITY X-RAY PHYSICAL DIMENSIONS MARK PERMANENCY LEAD INTEGRITY SOLDERABILITY X-RAY PHYSICAL DIMENSIONS MARK PERMANENCY LEAD INTEGRITY 9921 9921 DATE CODE CONDITION 9921 9921 9921 SENT TO OUTSIDE SOURCE MIL-STD-883-2003 MIL-STD-883-2012 : TOP & SIDE VIEW MIL-STD-883-2016 MIL-STD-883-2015 MIL-STD-883-2004 : COND B2 MIL-STD-883-2003 MIL-STD-883-2012 : TOP & SIDE VIEW MIL-STD-883-2016 MIL-STD-883-2015 MIL-STD-883-2004 : COND B2 Total: READPOINT QTY FAILS 5 3 6 6 6 6 3 6 6 6 6 0 0 0 0 0 0 0 0 0 0 0 0 FA# PRECONDITIONING LEVEL 3 DESCRIPTION STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW DATE CODE CONDITION 9921 125C 30C/60% R.H. 235C +5/-0C READPOINT 24 240 3 HRS HRS PASS Total: QTY FAILS 356 356 356 0 0 FA# TEMPERATURE CYCLE DESCRIPTION TEMP CYCLE TEMP CYCLE DATE CODE CONDITION 9921 9921 -55C TO 125C -55C TO 125C READPOINT 1000 CYS 1000 CYS QTY FAILS 77 91 0 0 FA# Total: 0 TEMPERATURE HUMIDITY BIAS DESCRIPTION HAST HAST DATE CODE CONDITION 9921 9921 130C, 85%R.H.,5.5V 130C, 85%R.H.,5.5V READPOINT 100 100 HRS HRS Total: QTY FAILS 45 90 1 0 1 FA# No FA UNBIASED MOISTURE RESISTANCE DESCRIPTION HAST, NO BIAS HAST, NO BIAS DATE CODE CONDITION 9921 9921 130C, 85% R.H. 130C, 85% R.H. READPOINT 200 200 HRS HRS Total: QTY FAILS 45 55 0 0 0 FA# Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: ATP (Amkor, PI) 32 TSOP 8x20x1.0 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 9913 to 0106 MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION PRECONDITION U/S ULTRASOUND STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW EXTERNAL VISUAL DATE CODE CONDITION 9913 J-STD-020 J-STD-020 125C 30C/60% R.H. 235C +5/-0C MIL-STD-883-2009 Total: 240 3 HRS HRS PASS READPOINT QTY FAILS 8 8 8 8 8 8 0 0 0 0 0 FA# OPERATING LIFE DESCRIPTION HIGH VOLTAGE LIFE HIGH VOLTAGE LIFE DATE CODE CONDITION 9913 0106 125C, 6.0 VOLTS 125C, 6.0 VOLTS READPOINT 1000 HRS 1000 HRS Total: QTY FAILS 85 256 0 2 2 iBATT LEAK FA# PACKAGE TESTS DESCRIPTION SOLDERABILITY X-RAY DATE CODE CONDITION 9913 9913 MIL-STD-883-2003 MIL-STD-883-2012 : TOP & SIDE VIEW READPOINT QTY FAILS 3 6 0 0 FA# PHYSICAL DIMENSIONS 9913 MARK PERMANENCY LEAD INTEGRITY MIL-STD-883-2016 MIL-STD-883-2015 MIL-STD-883-2004 : COND B2 Total: 6 6 6 0 0 0 0 PRECONDITIONING LEVEL 3 DESCRIPTION STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW DATE CODE CONDITION 9913 125C 30C/60% R.H. 235C +5/-0C READPOINT 24 240 3 HRS HRS PASS Total: QTY FAILS 315 315 315 0 0 FA# TEMPERATURE CYCLE DESCRIPTION TEMP CYCLE DATE CODE CONDITION 9913 -55C TO 125C READPOINT 1000 CYS Total: QTY FAILS 70 0 0 FA# TEMPERATURE HUMIDITY BIAS DESCRIPTION HAST DATE CODE CONDITION 9913 130C, 85%R.H.,5.5V READPOINT 100 HRS Total: QTY FAILS 70 0 0 FA# UNBIASED MOISTURE RESISTANCE DESCRIPTION HAST, NO BIAS DATE CODE CONDITION 9913 130C, 85% R.H. READPOINT 200 HRS Total: QTY FAILS 40 0 0 FA# Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: PACKAGE TESTS DESCRIPTION SOLDERABILITY NSEB 28 TSOP 8x13.4x0.965 Ciba-Geigy Aratonic 2184-4 (KMC 184) Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0432 to 0432 DATE CODE CONDITION 0432 JESD22-B102 READPOINT QTY FAILS 8 0 0 FA# Total: Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: CONSTRUCTION ANALYSIS DESCRIPTION CONSTRUCTION ANALYSIS NSEB 32 TSOP 8x20x1.0 Ciba-Geigy Aratonic 2184-4 (KMC 184) Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0145 to 0324 DATE CODE CONDITION 0146 TO BE SUBMITTED BY ASSEMBLY SITE READPOINT QTY FAILS 3 0 0 FA# Total: MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION ULTRASOUND STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW EXTERNAL VISUAL PRECONDITION U/S ULTRASOUND STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW EXTERNAL VISUAL PRECONDITION U/S ULTRASOUND STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW EXTERNAL VISUAL PRECONDITION U/S 0147 0146 DATE CODE CONDITION 0145 J-STD-020 125C 30C/60% R.H. 235C +5/-0C J-STD-020, 6.1a J-STD-020 J-STD-020 125C 30C/60% R.H. 235C +5/-0C J-STD-020, 6.1a J-STD-020 J-STD-020 125C 30C/60% R.H. 235C +5/-0C J-STD-020, 6.1a J-STD-020 Total: 24 192 3 HRS HRS PASS 24 192 3 HRS HRS PASS 24 192 3 HRS HRS PASS READPOINT QTY FAILS 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 0 0 0 0 0 0 0 0 0 0 0 0 0 FA# OPERATING LIFE DESCRIPTION HIGH VOLTAGE LIFE HIGH VOLTAGE LIFE HIGH VOLTAGE LIFE HIGH TEMP OP LIFE DATE CODE CONDITION 0145 0146 0147 0324 125C, 6.0 VOLTS 125C, 6.0 VOLTS 125C, 6.0 VOLTS 125C, 5.5 VOLTS READPOINT 1000 HRS 1000 HRS 1000 HRS 1000 HRS QTY FAILS 70 77 77 77 0 0 0 0 FA# HIGH TEMP OP LIFE 0324 125C, 5.5 VOLTS 988 HRS Total: 77 0 0 PACKAGE TESTS DESCRIPTION SOLDERABILITY X-RAY PHYSICAL DIMENSIONS MARK PERMANENCY LEAD INTEGRITY SOLDERABILITY X-RAY PHYSICAL DIMENSIONS MARK PERMANENCY LEAD INTEGRITY SOLDERABILITY X-RAY PHYSICAL DIMENSIONS MARK PERMANENCY LEAD INTEGRITY 0147 0147 0146 0146 DATE CODE CONDITION 0145 0145 JESD22-B102 MIL-STD-883-2012 : TOP & SIDE VIEW JESD22-B100 JESD22-B107 JESD22-B105 TEST CONDITION B JESD22-B102 MIL-STD-883-2012 : TOP & SIDE VIEW JESD22-B100 JESD22-B107 JESD22-B105 TEST CONDITION B JESD22-B102 MIL-STD-883-2012 : TOP & SIDE VIEW JESD22-B100 JESD22-B107 JESD22-B105 TEST CONDITION B Total: READPOINT QTY FAILS 3 6 6 6 6 3 6 6 6 6 3 6 6 6 6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 FA# PRECONDITIONING LEVEL 3 DESCRIPTION STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW STORAGE LIFE MOISTURE SOAK CONVECTION REFLOW 0147 0146 DATE CODE CONDITION 0145 125C 30C/60% R.H. 235C +5/-0C 125C 30C/60% R.H. 235C +5/-0C 125C 30C/60% R.H. 235C +5/-0C READPOINT 24 192 3 24 192 3 24 192 3 HRS HRS PASS HRS HRS PASS HRS HRS PASS Total: QTY FAILS 308 308 308 308 308 308 308 308 308 0 0 0 0 FA# TEMPERATURE CYCLE DESCRIPTION TEMP CYCLE TEMP CYCLE TEMP CYCLE DATE CODE CONDITION 0145 0146 0147 -55C TO 125C -55C TO 125C -55C TO 125C READPOINT 1000 CYS 1000 CYS 1000 CYS Total: QTY FAILS 70 77 77 0 0 0 0 FA# TEMPERATURE HUMIDITY BIAS DESCRIPTION HAST HAST HAST DATE CODE CONDITION 0145 0146 0147 130C, 85%R.H.,5.5V 130C, 85%R.H.,5.5V 130C, 85%R.H.,5.5V READPOINT 100 100 100 HRS HRS HRS QTY FAILS 44 77 77 0 0 0 FA# Total: 0 UNBIASED MOISTURE RESISTANCE DESCRIPTION HAST, NO BIAS HAST, NO BIAS HAST, NO BIAS DATE CODE CONDITION 0145 0146 0147 130C, 85% R.H. 130C, 85% R.H. 130C, 85% R.H. READPOINT 200 200 200 HRS HRS HRS Total: QTY FAILS 44 74 73 0 0 0 0 FA# FAILURE RATE: MTTF (YRS): 37651 FITS: 3.0 |
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